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US ISSUED PATENTS
  1. Sung Gyu Pyo: Backside illuminated sensor and manufacturing method thereof, Aug 4, 2011, US 2011/0186951 A1
  2. Sung Gyu Pyo: Method of manufacturing a COMOS Image Sensor, Jul. 28, 2011, US 2011/0180895 A1
  3. Sung Gyu Pyo and Dong Joon Kim: Package of MEMS device and method for fabricating the same, Feb 7, 2008, US 2008/0029864 A1
  4. Dong Joon Kim and Sung Gyu Pyo: Package of MEMS device and method for fabricating the same, Dec 20, 2007, US 2007/0290308 A1
  5. Sung Gyu Pyo: Method for forming inductor in semiconductor device, May 9, 2006, US 7,041,566
  6. Sung Gyu Pyo: Radio frequency semiconductor device and method of manufacturing the same, May 2, 2006, US 7,037,800
  7. Sung Gyu Pyo: Method for forming diffusion barrier film of semiconductor device, February 1, 2005, US 6,849,298
  8. Sung Gyu Pyo: Heater block having catalyst spray means, Jan. 25 2005, US 6,846,364
  9. Sung Gyu Pyo: Method of forming a metal wiring in a semiconductor device, April. 20 2004, US 6,723,645
  10. Sung Gyu Pyo and SibumKim: Cu film deposition equipment of semiconductor device, February 15, 2004, US 6,855,632
  11. Sung Gyu Pyo: Method of forming metal interconnection layer in semiconductor device, April 13, 2002, US 6,720,248
  12. Sung Gyu Pyo and Sibum Kim: Method of catalyzing copper deposition in a damascene structure by plasma treating the barrier layer and then applying a catalyst such as iodine or iodine compounds to the barrier layer, Nov. 11 2003, US 6,645,858
  13. Sung Gyu Pyo and SibumKim: Cu film deposition equipment of semiconductor device, Dec. 16 2003, US 6,664,636
  14. Sung Gyu Pyo: Method of forming a metal wiring in a semiconductor device, Sep. 30 2003, US 6,627,523
  15. Sung Gyu Pyo: Method of manufacturing a metal wiring in a semiconductor device, Sep. 9 2003, US 6,617,238
  16. Sung Gyu Pyo: Method of forming a metal wiring in a semiconductor device with copper seed, Jul. 15 2003, US 6,593,236
  17. Sung Gyu Pyo: Method of Forming a Metal Wiring in a Semiconductor Device, Mar. 4 2003, US 6,528,415
  18. Sung Gyu Pyo: Method of Forming a Copper Wiring in a Semiconductor Device, April 22 2003, US 6,551,932
  19. Sung Gyu Pyo: Method of Forming a Copper Wiring in a Semiconductor Device, Dec. 10. 2002, US 6,492,268
  20. Sung Gyu Pyo: Method of Forming a Copper Wiring in a Semiconductor Device, Oct. 22, 2002, US 6,468,907
  21. Sung Gyu Pyo: Method of Forming a Copper Wiring in a Semiconductor Device, Aug. 20 2002, US 6,436,826
  22. Sung Gyu Pyo: Method of Forming a Copper Wiring in a Semiconductor Device, July 2, 2002, US 6,413,864
  23. Sung Gyu Pyo: Method of Forming a Metal Wiring in a Semiconductor Device, April 23. 2002, US 6,376,356
  24. Sung Gyu Pyo: Liquid Delivery System, Feb. 26, 2002, US 6,349,887
  25. Sung Gyu Pyo and Heondo Kim: Method of Forming a Copper Wiring in a Semiconductor Device, Feb. 12, 2002, US 6,346,478
  26. Sung Gyu Pyo: Method of Forming a Copper Wiring in a Semiconductor Device, Jan. 8 2002, US 6,337,276


US Patents Applications
  • [One of Applications:Example] Sung Gyu Pyo: “Chip scale image sensor and method for fabricating the same” US PN (Pub. App. No.) 20050253176, Nov. 17 2005


대한민국 등록 특허
  1. Sung Gyu Pyo: 2010.1.19, 10-0938951
  2. Sung Gyu Pyo: 2010.1.18, 10-0938723
  3. Sung Gyu Pyo: 2009.3.4, 10-0888199
  4. Sung Gyu Pyo,Dong Joon Kim: 2008.7.9 ,10-0846569
  5. Sung Gyu Pyo,Dong Joon Kim: 2007.10.25, 10-0772321
  6. Sung Gyu Pyo: Method of manufacturing semiconductor device, Aug. 29, 2007, 10-0755636
  7. Sung Gyu Pyo: Method of forming a copper metal wiring in a semiconductor device, July. 23, 2007 10-0743770
  8. Sung Gyu Pyo: CMOS IMAGE SENSOR, June. 20, 2007, 10-0732846
  9. Sung Gyu Pyo: June. 12, 2007, 10-0729743
  10. Sung Gyu Pyo: May.17, 2007, 10-0721625
  11. Sung Gyu Pyo: Apr. 2, 2007, 10-0705007
  12. Sung Gyu Pyo: Mar. 6, 2007, 10-0694469
  13. Sung Gyu Pyo: Showerhead, Jan. 16, 2007, 10-0673211
  14. Sung Gyu Pyo: Method of forming a metal line in a semiconductor device, Jan. 12, 2007, 10-0671610
  15. Sung Gyu Pyo: Method of forming a copper metal wiring in a semiconductor device, Jan. 5, 2007, 10-0667905
  16. Sung Gyu Pyo: FOR FABRICATION OF IMAGE SENSOR USING System in Package(SiP), Dec. 11, 2006, 10-0658929
  17. Sung Gyu Pyo: Nov. 2, 2006, 10-0644522
  18. Sung Gyu Pyo: Nov. 1, 2006, 10-0644020
  19. Sung Gyu Pyo: Sep. 4, 2006, 10-0622637
  20. Sung Gyu Pyo: Method of forming a copper wiring in a semiconductor device, Aug. 7, 2006, 10-0612542
  21. Sung Gyu Pyo: Method of forming a copper wiring in a semiconductor device, Aug. 7, 2006, 10- 0612543
  22. Sung Gyu Pyo: Method of forming a copper wiring in a semiconductor device, Aug. 7, 2006, 10-0612548
  23. Sung Gyu Pyo: June 30 2006, 10-0598347
  24. Sung Gyu Pyo: Chip scale image sensor and method of fabricating the same, June 27 2006, 10-0596751
  25. S.H. Lee, Sung Gyu Pyo, Sibum Kim, S.D. Kim: Method of forming a metal wiring in a semiconductor device, June 16, 2006, 10-0593126
  26. Sung Gyu Pyo: Method of manufacturing inductor in a semiconductor device, April 28, 2006, 10-0577529
  27. Sung Gyu Pyo: Method of forming a copper wiring in a semiconductor device, April 25, 2006, 10-0576046
  28. Sung Gyu Pyo: Method of forming a metal line in a semiconductor device, April 3, 2006, KOREA 10-0569580
  29. Sung Gyu Pyo: Radio frequency semiconductor device and method of manufacturing the same, April 3, 2006, 10-0569590
  30. Sung Gyu Pyo: Method of forming a inductor in a semiconductor device, Mar 30 2006, 10-0568418
  31. Sung Gyu Pyo: Method of forming a inductor in a semiconductor device, Mar. 30, 2006, 10-0568417
  32. Sung Gyu Pyo: Method of forming a inductor in semiconductor device, Mar. 30, 2006, 10-0568416
  33. Sung Gyu Pyo: Method of forming a inductor in a semiconductor device, Mar. 30, 2006, 10-0568415
  34. Sung Gyu Pyo: Method of forming a copper wiring in a semiconductor device, Mar. 2, 2006, 10-0559030
  35. Sung Gyu Pyo: Method of manufacturing inductor in a semiconductor device, Nov. 8, 2005, 10-0528796
  36. Sung Gyu Pyo: Method of manufacturing inductor in a semiconductor device, Oct. 28, 2005, 10-0526577
  37. Sung Gyu Pyo: Method of forming an inductor in a semiconductor device, Oct. 18, 2005, 10-0523917
  38. Sung Gyu Pyo: Method of forming an inductor in a semiconductor device, Oct.13, 2005, 10-0523137
  39. Sung Gyu Pyo: Method for Forming Barrier Layer of Semiconductor Device, Sep. 28, 2005, 10-0519376
  40. Sung Gyu Pyo: Method of forming a diffusion barrier layer in a semiconductor device, July 18, 2005, 10-0503965
  41. Sung Gyu Pyo: Method of forming inductor, Mar. 4, 2005, 10-0476708
  42. Sung Gyu Pyo: Method for manufacturing an inductor, Feb. 28, 2005, 10-0475534
  43. Sung Gyu Pyo: Method for forming a diffusion barrier layer and method for forming a metal line using the same in semiconductor device, Feb. 28, 2005, 10-0475529
  44. Sung Gyu Pyo: Method of forming a metal line in a semiconductor device, Feb. 14, 2005, 10-0472859
  45. Sung Gyu Pyo: Method of forming inductor, Jan. 4, 2005, KOREA 10-0466210
  46. Sung Gyu Pyo: Method for manufacturing metal interconnection layer of semiconductor device, Dec. 27, 2004, 10-0465063
  47. Sung Gyu Pyo: Method of forming a copper wiring in a semiconductor device, Nov. 30, 2004, 10-0460746
  48. Sung Gyu Pyo: Method of forming a copper wiring in a semiconductor device, Oct. 29, 2004, 10-0456259
  49. Sung Gyu Pyo: Method for forming interconnect structures of semiconductor device, Sep. 24, 2004, 10-0451767
  50. Sung Gyu Pyo: Method for forming interconnect structures of semiconductor device, Sep. 24, 2004, 10-0451766
  51. Sung Gyu Pyo: Method of forming a copper wiring in a semiconductor device, April 30, 2004, 10-0431105
  52. Sung Gyu Pyo: Method of manufacturing a transistor in a semiconductor device, April 29, 2004, 10-0431085
  53. Sung Gyu Pyo: Method for forming interconnect structures of semiconductor device, Feb. 25, 2004, 10-0421913
  54. Sung Gyu Pyo: Chemical enhancer management chamber and the using Cu film deposition equipment of semiconductor device, Dec. 18, 2003, 10-0413482
  55. Sung Gyu Pyo: Cu film deposition equipment of semiconductor device, Dec. 18, 2003, 10-0413481
  56. Sung Gyu Pyo: Method of forming a copper metal wiring in a semiconductor device, Nov. 19, 2003, 10-0407678
  57. Sung Gyu Pyo: Method of forming a copper wiring in a semiconductor device, Nov. 19, 2003, 10-0407679
  58. Sung Gyu Pyo: Method of forming a copper metal wiring in a semiconductor device, Nov. 19, 2003, 10-0407682
  59. Sung Gyu Pyo: Method of forming a metal wiring in a semiconductor device, Nov. 19, 2003, 10-0407680
  60. Sung Gyu Pyo: A method of forming a metal line in a semiconductor device, Nov. 19, 2003, 10-0407681
  61. Sung Gyu Pyo: Showerhead and an Apparatus for Supplying a Liquid Raw Materials Using the Same, Nov. 6, 2003, 10-0406176
  62. Sung Gyu Pyo: Showerhead used chemically enhanced chemical vapor deposition equipment, Nov. 6, 2003, 10-0406174
  63. Sung Gyu Pyo: Apparatus for supplying a liquid raw materials and a method of forming a copper layer using the same, Nov. 6, 2003, 10-0406175
  64. Sung Gyu Pyo: Heater Block Having Catalyst Injection means, Nov. 6, 2003, KOREA 10-0406173
  65. Sung Gyu Pyo: Method of forming a metal wiring in a semiconductor device, Oct. 29, 2003, 10-0404941
  66. Sung Gyu Pyo: Method of forming a metal wiring in a semiconductor device, Oct. 29, 2003, 10-0404942
  67. Sung Gyu Pyo: Method of forming a metal wiring in a semiconductor device, Oct. 16, 2003, 10-0403454
  68. Sung Gyu Pyo: Method of forming a metal wiring in a semiconductor device, Sep. 1, 2003, 10-0398038
  69. Sung Gyu Pyo: Duplex zone showerhead and chemical enhanced chemical vapor deposition equipment utilizing the same, June 28, 2003, 10-0390961
  70. Sung Gyu Pyo: Method of forming a metal wiring in a semiconductor device, May 29, 2003, 10-0387255
  71. Sung Gyu Pyo, Sibum Kim: Method of forming a copper wiring in a semiconductor device, April 29, 2003, 10-0383759
  72. Sung Gyu Pyo: Method of manufacturing semiconductor device, April 1, 2003, 10-0380153
  73. Sung Gyu Pyo: Method of manufacturing a transistor in a semiconductor device, April 1, 2003, 10-0380163
  74. Sung Gyu Pyo: Method of manufacturing a transistor in a semiconductor device, April 1, 2003, 10-0380154
  75. Sung Gyu Pyo: Liquid delivery system, Jan. 3, 2003, 10-0368319
  76. Sung Gyu Pyo: Method of forming a metal wiring in a semiconductor device, Nov. 25, 2002, 10-0363847
  77. Sung Gyu Pyo: Method of forming a copper wiring in a semiconductor device, Oct. 10, 2002, 10-0358045
  78. Sung Gyu Pyo: Method of forming a copper wiring in a semiconductor device, Oct. 10, 2002, 10-0358047
  79. Sung Gyu Pyo: Method and Tool for Forming a Copper Wiring in a Semiconductor Device, Aug. 21, 2002, 10-0351237
  80. Sung Gyu Pyo: Method of manufacturing a capacitor in a semiconductor device, Aug. 21, 2002, 10-0351247
  81. Sung Gyu Pyo: Method of forming gate electrode of semiconductor device including Co-silicide, June 19, 2002, 10-0342867
  82. T.H. Cha, Sung Gyu Pyo: Method of forming a metal wiring in a semiconductor device, June 11, 2002, 10-0341849
  83. Sung Gyu Pyo: Method of forming a copper wiring in a semiconductor device, May 13, 2002, 10-0338112
  84. Sung Gyu Pyo: Method of forming a copper wiring in a semiconductor device, Sep.11, 2001, 10-0309809
  85. Sung Gyu Pyo: Method of forming a metal wiring in a semiconductor device, Dec. 5, 2000, 10-0283110


Japan, Germany, Taiwan, China, United Kingdom PATENTS
  1. Sung Gyu Pyo: Rear illuminated Image Sensor and Manufacturing Method for same, 09762661.8 (2011.09.02) EU
  2. Sung Gyu Pyo: Method for manufacturing CMOS Image Sensor, 4001509 (2011.09.02) EU
  3. Sung Gyu Pyo: Method for forming diffusion barrier film of semiconductor device, 4001509 (2007.08.24) Japan
  4. Sung Gyu Pyo: Deposition System of Copper thin film in semiconductor device, 3996804 (2007.08.10 ) Japan
  5. Sung Gyu Pyo: Package of mems device and method for fabricating the same, 2007-331098 (2007.12.27) Japan
  6. Sung Gyu Pyo: Liquid delivery system, 3831165 (2006.07.21) Japan
  7. Sung Gyu Pyo: High frequency semiconductor device and its manufacturing method, 2005-197638 (2005.07.21) Japan
  8. Sung Gyu Pyo: Inductor forming method for semiconductor device, 2005-039186 (2005.02.10) Japan
  9. Sung Gyu Pyo: Chemical enhancer treatment chamber and cu thin film deposition equipment of semiconductor device using the same, 2003-055769 (2003.02.26) Japan
  10. Sung Gyu Pyo: Method of forming anti-diffusion film of semiconductor device, 2003-059930, (2003.02.28) Japan
  11. Sung Gyu Pyo: Apparatus for depositing copper thin film for semiconductor element, 2003-051460, (2003.02.21) Japan
  12. Sung Gyu Pyo: Method for forming metal line of semiconductor device, 2002-190524 (2002.07.05) Japan
  13. Sung Gyu Pyo: Method for forming metal wiring of semiconductor element, 2002-100630 (2002.04.05) Japan
  14. Sung Gyu Pyo: Metal wiring formation method of semiconductor device, 2002-083813 (2002.03.22) Japan
  15. Sung Gyu Pyo: Heater block having catalyst injecting means, 2002-057194 (2002.02.22) Japan
  16. Sung Gyu Pyo: Copper metal wiring formation method of semiconductor device, 2002-033391 (2002.01.31) Japan
  17. Sung Gyu Pyo: Shower head used for cecvd system, 2002-030445 (2002.01.31)Japan
  18. Sung Gyu Pyo: Method of forming metal interconnection of semiconductor device, 2002-026124 (2002.01.25) Japan
  19. Sung Gyu Pyo: Method of forming metal interconnection of semiconductor device, 2002-026120 (2002.01.25) Japan
  20. Sung Gyu Pyo: Method of forming copper metal wiring for semiconductor element, 2002-026019 (2002.01.25) Japan
  21. Sung Gyu Pyo: Method of forming metal wiring of semiconductor element, 2002-026017 (2002.01.25) ) Japan
  22. Sung Gyu Pyo and Sibum Kim: Copper metal wiring formation method of semiconductor element, 2002-016137 (2002.01.18)
  23. Sung Gyu Pyo: Device for supplying raw liquid material and method for forming copper layer therewith, 2002-012975 (2002.01.15) Japan
  24. Sung Gyu Pyo: Method of forming a copper metal wiring for semiconductor element, 2001-217205 (2001.08.10) Japan
  25. Sung Gyu Pyo: Method of forming a copper metal wiring for semiconductor element, 2001-217204 (2001.08.10) Japan
  26. Sung Gyu Pyo: Duplex zone showerhead and chemical enhanced CVD-device using the same, 2001-214274, (2001.08.07) Japan
  27. Sung Gyu Pyo: Method of forming metal interconnection for semiconductor device, 2001-144094 (2001.05.25) Japan
  28. Sung Gyu Pyo & Heondo Kim: Copper metal wiring forming of semiconductor device, 2000-299296 (2000.10.24) Japan
  29. Sung Gyu Pyo: Liquid carrying device, 2000-199066, (2000.07.18) Japan
  30. Sung Gyu Pyo : Liquid delivery system, 414843 (2000.12.11) TAIWAN, PROVINCE OF CHINA
  31. Sung Gyu Pyo and Sibum Kim: Method of manufacturing a copper metal wiring in a semiconductor device, 501256 (2002.09.01) TAIWAN
  32. Sung Gyu Pyo: Duplex zone showerhead and chemical enhanced chemical vapor deposition equipment utilizing the same, 466616 (2001.12.01) TAIWAN
  33. Sung Gyu Pyo : Method of forming a metal wiring in a semiconductor device, 490805 (2002.06.11) TAIWAN,
  34. Sung Gyu Pyo: Method of forming metal wiring in a semiconductor device, 492173 (2002.06.21) TAIWAN,
  35. Sung Gyu Pyo & Heodo Kim: Method of forming a copper wiring in a semiconductor device, 444299 (2001.07.01) TAIWAN,
  36. Sung Gyu Pyo Method for forming metal line of semiconductor device, 515044 (2002.12.21) TAIWAN
  37. Sung Gyu Pyo Chemical enhancer treatment chamber and cu thin film deposition equipment of semiconductor device using the same, 567539 (2003.12.21) TAIWAN
  38. Sung Gyu Pyo Cu film deposition equipment of semiconductor device 504757 (2002.10.01) TAIWAN, PROVINCE OF CHINA
  39. Sung Gyu Pyo Method of forming copper wiring in semiconductor device 486746 (2002.05.11) TAIWAN
  40. Sung Gyu Pyo Method of forming a copper wiring in a semiconductor device 503517 (2002.09.21) TAIWAN
  41. Sung Gyu Pyo : Method for forming metal interconnecting layers in semiconductor device, 1270371 (2006.08.16), CHINA
  42. Sung Gyu Pyo: Radio frequency semiconductor device and method of manufacturing the same, 100337330 (2007.09.12) CHINA
  43. Sung Gyu Pyo : Method for forming metal wires in semiconductor device, 1351374 (2002.05.29) CHINA
  44. Sung Gyu Pyo: Method of forming copper wiring in semiconductor device, 1308371 (2001.08.15) CHINA
  45. Sung Gyu Pyo & HeondoKim: Method for forming copper wires in semiconductor device, 1270413 (2000.10.18) CHINA
  46. Sung Gyu Pyo : Liquid conveying system, 1260407 (2000.07.19) CHINA
  47. Sung Gyu Pyo : Method of forming copper wiring in semiconductor device, 1308370 (2001.08.15) CHINA
  48. Sung Gyu Pyo : Verfahren zum herstellrn einer metallleitung eines halbleiterbauteils, 10150160 (2002.05.08) GERMANY
  49. Sung Gyu Pyo & Heondo Kim: Verfahren zur herstellung einer kupferverdrahtung fuer eine halbleitervorrichtung, 19953843 (2000.10.26) GERMANY
  50. Sung Gyu Pyo: Method of forming a copper wiring in a semiconductor device, 10064041 (2001.06.28 ) GERMANY
  51. Sung Gyu Pyo : Method of forming copper wiring in semiconductor device, 10064042 (2001.06.28 ) GERMANY
  52. Sung Gyu Pyo : Fluessigkeits-abgabesystem, 19956472 (2000.07.06) GERMANY
  53. Sung Gyu Pyo : Method for forming a metal line of a semiconductor device, 2371148 (2005.03.09) UNITED KINGDOM
  54. Sung Gyu Pyo & Heondo Kim: Method of forming a copper wiring in a semiconductor device, 2348888 (2003.10.22) UNITED KINGDOM
  55. Sung Gyu Pyo: Method of forming a copper wiring in a semiconductor device, 200029288 (2001.01.17)
  56. Sung Gyu Pyo: Method of forming a copper wiring in a semiconductor device, 2397947 (2004.10.06) UNITED KINGDOM
  57. Sung Gyu Pyo: Liquid delivery system for chemical vapour deposition method, 2345298 (2003.12.10) UNITED KINGDOM
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