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Conferences
  1. Jin Hyun Choe, Da Won Ahn, Jin Seok Kim, Dae Sik Kim, Jae Bin Kim, Shung Chul Lee, Kyung Soo Kim and Sung Gyu Pyo "Study on Glucose Sensing Materials based on CNT/graphene-Ag Composite for Nano-electrode Sensor" as a part of ICASS(International Congerence on Applied Surface Science) 2021, Online Live from June, 29-30, 2021
  2. Jin Hyun Choe, Da Won Ahn, Jin Seok Kim, Eun Mi Choi and Sung Gyu Pyo "Effect of Pulsed Light Irradiation on Patterning of Reduction Graphene Oxdie-Graphene Oxide Interconnection for Power Devices" as a part of ICAE(International Conference on Advanced Electromaterials) 2021, Korea from Nov. 9-12, 2021 (Online Oral Presentation)
  3. Jin Hyun Choe, Da Won Ahn, Jin Seok Kim, Ji Woo Han, Eun Ji Kim and Sung Gyu Pyo "Determination of Composition Particle Size Distribution in Oxide Abrasive Slurry after Chemical Mechanical Polishing Process using Raman Spectra" as a part of ENGE 2020, Korea from Nov. 1-4, 2020
  4. Jin Seok Kim, Areum Kim, Da Won Ahn, Jin Hyun Choe, Ji Woo Han, Eun Ji Kim and Sung Gyu Pyo "Synthesis of Nickel Nanotube Composites by Electrospinning and Electroless Deposition" as a part of ENGE 2020, Korea from Nov. 1-4, 2020
  5.  Da Won Ahn, Jin Hyun Choe, Jin Seok Kim, Ji Woo Han, Eun Ji Kim and Sung Gyu Pyo "Real-time Raman Monitoring Method on Cleaning Solution" as a part of ENGE 2020, Korea from Nov. 1-4, 2020
  6. Eunmi Choi, Yinhua Cui, Yuan Gao, and Sung Gyu Pyo “Improvement of Contact Resistance Characteristics between Graphene-carbon Nanotube for Carbon Semiconductor” as a part of the 2019 Nanotech in France from June, 26-28, 2019
  7. Yinhua Cui, Yuan Gao, and Sung Gyu Pyo “Real-time Raman Analysis of Cleaning Solution: Determination of Al/Alq3 Residue in Cleaning Mixture” as a part of the ENGE 2018, Korea from Nov. 11-14, 2018
  8. Yinhua Cui, Yuan Gao, and Sung Gyu Pyo “Study on Sensing Materials based on carbon nano tube for Electrochemical Sensing” as a part of the ENGE, Korea from Nov. 11-14, 2018
  9. Eun mi Choi, Yinhua cui, Ho Jae Shim, Yuan Gao and Sung Gyu Pyo “탄소반도체를 위한 카본나노튜브와 그래핀의 나노영역 접촉저항 개선에 관한 연구” as a part of Kmeps, Korea from April. 05-06, 2018
  10. Yuan Gao, Yinhua Cui, Ho Jae Shim, Kang Won Lee “Deposition process of CuIn1-xGaxSe2 thin films by Electroless Plating (ELP)” as a part of THE KOREAN CERAMIC SOCIETY, Korea from April. 19-21, 2017
  11. Yinhua Cui, Yuan Gao, and Sung Gyu Pyo* “Real time monitoring method on organic and inorganic cleaning solutions in organic light emitting diode (OLED) process” as a part of ICAE 2017 , Korea from Nov. 21-24, 2017
  12. Soon Hyeong Kwon1, Eunmi Choi1, Long shou Zheng1, Yin hua Cui1, Areum Kim1, Minwoo Nam1, 2, Keunwon Kang1, In young Choi1, Hun young Jeong1 and Sung Gyu Pyo*1 “Microstructural evolution of silver nano thin film complex structure with functional particle for improving conventional and electrical performance” as a part of ENGE 2016, Korea from Nov. 06-09, 2016
  13. Areum Kim, Keun Won Kang, Eunmi Choi, Soon Hyeong Kwon, Sujin Chae, Minseok Oh, Sung Pil Yoon and Sung Gyu Pyo “Microstructural Evaluation of Carbon Based Nanocomposite Tube for Water Splitting and SOFC Electrode” as a part of the 2015 Journée d’Electrochimie in Rome, Italy from Jul. 6-10, 2015
  14. Minwoo Nam, Eunmi Choi, Areum Kim, Keunwon Kang, Longshou Zheng, Soon Hyeong Kwon, Su Jin Chae, Seon Jea Lee, Ju Young Yun, and Sung Gyu Pyo “Microstructural Evolution of Plasma Enhanced Cu thin film on the Oxygen Stuffed Nano-thin Ta/TaONx/TaNx Nanosandwitch Structure” as a part of the 2015 Nano Kore, Korea from Jul. 1-3, 2015
  15. Keunwon Kang, Eunsoo Jeong, Eunmi Choi, Areum Kim, Minwoo Nam, Longshou Zheng, Soon Hyeong Kwon, Su Jin Chae, Seon Jea Lee , Hoon Huh, and Sung Gyu Pyo “Pattern Collapse Improvement in Lightly Doped Drain (LDD) and Source/Drain Implant Nano-Lithography Process” as a part of the 2015 Nano Kore, Korea from Jul. 1-3, 2015
  16. Eunmi Choi, Sung Gyu Pyo “원자현미경을 활용한 삼차원 집적공정의 계면 접합강도 측정에 관한 연구” as a part of the 2015 Spring Conference of the Korean Institute of Metals and Materials in Changwon, Korea from Apr. 22-24, 2015
  17. Areum Kim, Keunwon Kang, Eunmi Choi, Soon Hyeong Kwon, Longshou Zheng, Minwoo Nam, Sujin Chae, and Sung Gyu Pyo “Microstructural Evolution of Electroless Deposited Nickel Nanofibers on a High-performance Electrochemical Membrane Reactor” as a part of the 2015 Spring Conference of the Korean Institute of Metals and Materials in Changwon, Korea from Apr. 22-24, 2015
  18. Eunmi Choi, Jae Kwang Kim, Su Jin Chae, Min Seok Oh, Yinhua Cui, Areum Kim, Songhun Yoon, Sung Gyu Pyo “Performance of graphene-based anode using chemically reduced nanocomposite formation”, as a part of the 2015 Materials Challenges in Alternative and Renewable Energy(MCARE) in Jeju, Korea from Feb. 24-27, 2015
  19. Yinhua Cui, Soon Hyeong Kwon, Eunmi Choi, Areum Kim, Seon Jea Lee, Keun Won Kang, Soyun Park, Sung Gyu Pyo “Chemical Analysis of Patterned Mask Cleaning in Organic Light Emitting Diode Fabrication with Raman Spectroscopy”, as a part of the 2014 Electronic Materials and Nanotechnology for Green Environment (ENGE) in Jeju, Korea from Nov. 16-20, 2014
  20. Jae Kwang Kim, Eunmi Choi, Daeun Kim, Ilbok Lee, Keun Won Kang, Soyun Park, Areum Kim, Sung Gyu Pyo, Songhun Yoon “Enhancement of anode performance by nanocomposite formation between graphene and tin-oxide” as a part of the 2014 Electronic Materials and Nanotechnology for Green Environment (ENGE) in Jeju, Korea from Nov. 16-20, 2014
  21. Eunmi Choi, Su Jin Chae, Min Seok Oh, Yong Won Cha, Sung Gyu Pyo “Eutectic bonding utilizing radio frequency induction heating for fabricating vertical light-emitting diodes” as a part of the 2014 Electronic Materials and Nanotechnology for Green Environment (ENGE) in Jeju, Korea from Nov. 16-20, 2014
  22. Eunmi Choi, Areum Kim, Sung Gyu Pyo “Substrate-site self assembly of aligned carbon nanotubes using atomic force microscopy” as a part of the 2014 Electronic Materials and Nanotechnology for Green Environment (ENGE) in Jeju, Korea from Nov. 16-20, 2014
  23. Areum Kim, Sung Gyu Pyo “Microstructural Characterization of wet electrode in heterojuction with intrinsic thin layer(HIT) solar cell” as a part of the 2014 Global Photovoltaic Conference (GPVC) in Busan, Korea from Nov.10-11, 2014
  24. Areum Kim, Seonjea Lee, Yinhua Cui, Eunmi Choi, Keun Won Kang, Soon Hyeong Kwon, Su Jin Chae, Min Seok Oh, Sung Gyu Pyo “Thermal Stability of Ni-Silicide Phases with Electroless Deposited Ni-Cu-Sn Metallization” as a part of the 11st Korea-Japan Symposium on Materials and Interfaces in Jeju, Korea from Nov 5-8, 2014
  25. Areum Kim, Keun Won Kang, Yinhua Cui, Eunmi Choi, Sung Pil Yoon, Sung Gyu Pyo “Microstructural Evolution of Electroless Deposited Nickel Interfacial Phases on Phosphorus Doped Silicon Surface” as a part of the 2014 Fall Conference of the Korean Institute of Metals and Materials in Jeongseon, Korea from Oct. 23-24, 2014
  26. Eunmi Choi, Yinhua Cui, Areum Kim, Su Jin Chae, Min Seok Oh, Soon Hyeong Kwon, Sung Gyu Pyo “New Technology of Bonding force Measurement for Three-Dimensional(3D) Integration” as a part of the 2014 Fall Conference of the Korean Institute of Metals and Materials in Jeongseon, Korea from Oct. 23-24, 2014
  27. Yinhua Cui, Eunmi Choi, Areum Kim, Seonjea Lee, Sung Gyu Pyo “Studies on wet cleaning applied to the pre-treatment process of electrode formation in Si-based solar cell” as a part of the 2014 Fall Conference of the Korean Institute of Metals and Materials in Jeongseon, Korea from Oct. 23-24, 2014
  28. Jin Yeong Kim, Sung Hoon Hong, Sang Hyun Ahn, Sung Gyu Pyo, Jong Hyun Jang, Soo-Kil Kim “Fabrication of Transition Metal Alloy Catalysts for Water Electrolysis using Electrodeposition” as a part of the 2014 15th Advanced Batteries, Accumulators and Fuel Cells(ABAF) in Brno, Czech from Aug.24-28, 2014
  29. Eunmi Choi, Seonjea Lee, Yinhua Cui, Areum Kim, Soon Hyeong Kwon, Su Jin Chae, Min Seok Oh, Sung Gyu Pyo “Pattern Collapse Improvement in Lightly Doped Drain(LDD) and Source/Drain Implant Nano-Lithography Process” as a part of the 2014 International Conference on Microelectronics and Plasma Technology(ICMAP) in Gunsan, Korea from Jul. 8-11, 2014
  30. Eunmi Choi, Seonjea Lee, Yinhua Cui, Areum Kim, Soon Hyeong Kwon, Su Jin Chae, Min Seok Oh, Sung Gyu Pyo “Dead Zone Variation and White Sensitivity of CMOS Image Sensor using Chemical Mechanical Polishing Treatment” as a part of the 2014 International Conference on Microelectronics and Plasma Technology(ICMAP) in Gunsan, Korea from Jul. 8-11, 2014
  31. Eunmi Choi, Jae Kwang Kim, Keun Won Kang, Areum Kim, Sung Gyu Pyo, Songhun Yoon “Investigation about electrochemical charge storage mechanism of graphene supercapacitor electrodes and their electrochemical activation” as a part of the 2014 International Conference on Microelectronics and Plasma Technology(ICMAP) in Gunsan, Korea from Jul. 8-11, 2014
  32. Yinhua Cui, Areum Kim, Seon Jea Lee, Eunmi Choi, Soon Hyeong Kwon, Keunwon Kang, Soyeon Park and Sung Gyu Pyo “Characterization and Formation of Selectively Deposited Solar Electrode using Electroless Plating Process” as a part of the 2014 Electrochemical Conference on Energy and the Environment(ECEE) in Shanghai, China from Mar. 13-16, 2014
  33. Seonjea Lee, Eunmi Choi, Areum Kim, Hee Soo Choi, Yinhua Cui, Dong Joon Kim, Sung Gyu Pyo “Effect of Cu Pad Morphology on the Direct-Cu Pillar Process in CMOS image sensor”, as a part of the 2nd International Conference on Advanced Electromaterials (ICAE) in Jeju, Korea from Nov 12-15, 2013.
  34. Hee Soo Choi, Sung Gyu Pyo, Hyung Bin Son, Seonjea Lee, Eunmi Choi, Yinhua Cui, Areum Kim, Ukjae Lee, Byambasuren Gerelt-Od, Soon Hyeong Kwon, Chang Hyun Kim “Raman studies of All Wet processed CIGS film”, as a part of the 2nd International Conference on Advanced Electromaterials (ICAE) in Jeju, Korea from Nov 12-15, 2013.
  35. Areum Kim, Sung Gyu Pyo, Seonjea Lee, Eunmi Choi, Yinhua Cui, Hee Soo Choi, Chang Hyun Kim, Soon Hyeong Kwon “In-Situ AFM Investigation of Mechanical and Thermal Characterization of Electroless Nickel Silicide Contacts for Si-Based Solar Cell”, as a part of the 2nd International Conference on Advanced Electromaterials (ICAE) in Jeju, Korea from Nov 12-15, 2013.
  36. Eunmi Choi, Yinhua Cui, Heesoo Choi, Areum Kim, Sung Gyu Pyo “Characteristic of metallic bonding interface and bonding strength measurement using Atomic force microscopy”, as a part of the 2nd International Conference on Advanced Electromaterials (ICAE) in Jeju, Korea from Nov 12-15, 2013
  37. Areum Kim, Yinhua Cui, Seonjea Lee, Eunmi Choi, Hee Soo Choi, Chang Hyun Kim, Soon Hyeong Kwon, Sung Gyu Pyo “Phase Instability of Electroless Processed Electrode in Si-Based Solar Cell”, as a part of the European Congress and Exhibition on Advanced Materials and Processes (EUROMAT) in Sevila, Spain from Sep 8-13, 2013.
  38. Eunmi Choi, Yinhua Chu, Soon Hyeong Kwon, Areum Kim, Hee Soo Choi, Seonjea Lee, and Sung Gyu Pyo “Characteristic of hybrid bonding nature using Atomic force microscopy with carbon-nanotube Tip”, as a part of the European Congress and Exhibition on Advanced Materials and Processes (EUROMAT) in Sevila, Spain from Sep 8-13, 2013.
  39. Yinhua Chu, Areum Kim, Seonjea Lee, Eunmi Choi, Hee Soo Choi, Chang Hyun Kim, Soon Hyeong Kwon, and Sung Gyu Pyo “On the Improvement of Series Contact Resistance and Interface Modification in solar cell electrode”, as a part of the European Congress and Exhibition on Advanced Materials and Processes (EUROMAT) in Sevila, Spain from Sep 8-13, 2013.
  40. Hee Soo Choi, Areum Kim, Seonjea Lee, Eunmi Choi, Yinhua Cui, Chang Hyun Kim, Soon Hyeong Kwon, Sung Gyu Pyo “Microstructural Evolution of All Wet CIGS Film with in-situ Raman Spectroscopy”, as a part of the European Congress and Exhibition on Advanced Materials and Processes (EUROMAT) in Sevila, Spain from Sep 8-13, 2013.
  41. Eunmi Choi, Yinhua Chu, Areum Kim, Seon Jea Lee, Hee Soo Choi, and Sung Gyu Pyo: Process Integration of Surface and Bulk Micromachining in 3-axis Acceleration Sensor, The 15th International Conference on Electronic Materials and Packaging(EMAP), 2013, Seoul
  42. Eunmi Choi, Yinhua Chu, Areum Kim, Seon Jea Lee, Hee Soo Choi, and Sung Gyu Pyo: Characterization and Planarity on 3-dimensional Integrated Processing in Backside-illuminated Image Sensor, The 15th International Conference on Electronic Materials and Packaging(EMAP), 2013, Seoul
  43. Eunmi Choi, Yinhua Chu, Areum Kim, Seon Jea Lee, Hee Soo Choi, and Sung Gyu Pyo: Characterization of Interfacial Strength of Direct-Cu Pillar in Cu-low k interconnections for CMOS Image Sensor, The 15th International Conference on Electronic Materials and Packaging(EMAP), 2013, Seoul
  44. Eunmi Choi, Yinhua Chu, Areum Kim, Seon Jea Lee, Hee Soo Choi, and Sung Gyu Pyo: Reliable Measurement Methodology of Wafer Bonding Strength Using Atomic Force Microscopy, The 15th International Conference on Electronic Materials and Packaging(EMAP), 2013, Seoul
  45. Eunmi Choi, Soonhyung Kown, Yinhua Cui, Hee Soo Choi, Areum Kim, Seonjea Lee, Changhyun Kim, Sung Gyu Pyo “원자현미경을 이용한 3D integeration의 계면접합특성연구” as a part of the 2013 Spring Symposium of the Korean Institute of Chemical Engineers in Gwangju, Korea from Apr. 24-26, 2014
  46. Yinhua Cui, Eunmi Choi, Seonjea Lee, Areum Kim Sung Gyu Pyo, “Study about the Adhesion of surface of p-type silicon wafer after 3-aminopropyltriethoxysilane(APTES) treatment” as a part of the 2013 Spring Symposium of the Korean Institute of Chemical Engineers in Gwangju, Korea from Apr. 24-26, 2014
  47. Heesoo Choi, Sung Gyu Pyo “무전해도금법을 이용한 thin film CIGS layer 증착과 박막 물성의 특성 분석” as a part of the 2013 Spring Symposium of the Korean Institute of Chemical Engineers in Gwangju, Korea from Apr. 24-26, 2014
  48. J. Lim, Sung Gyu Pyo, D. Lee, H. Park and S. Kim “Electrochemically Fabricated metal Catalysts for Glucose Oxidation in Bio Fuel Cell Application”, as a part of the 222nd Meeting of The Electrochemical Society in Honolulu, USA from Oct 7-12, 2012.
  49. H. Park, Sung Gyu Pyo, D. Lee, S. Kim and H. Park “Surface Modification of Titanium Dioxide Nanoparticles with Gold Nanoparticles for Bio Fuel Cell Application”, as a part of the 222nd Meeting of The Electrochemical Society in Honolulu, USA from Oct 7-12, 2012.
  50. Areum, Kim, Sun Jae Lee, Chang Hyun Kim, and Sung Gyu Pyo “Microstructural Evolution of Selectively Deposited Ni/Cu/Sn Electrode in Si-based Sola Cell”, as a part of the 221st Meeting of The Electrochemical Society in Seattle, USA from May 6-10, 2012.
  51. Sun Jae Lee, Areum Kim, Hyunjun Park, Soo Won Kim, and Sung Gyu Pyo “Development of Selective Electroless Deposited Electode in Heterojunction with Intrinsic Thin Layer (HIT) Solar Cell”, as a part of the 221st Meeting of The Electrochemical Society in Seattle, USA from May 6-10, 2012.
  52. Hyunjin Park, Eunmi Choi, Areum Kim, Sun Jae Lee, Young-Won Cha, and Sung Gyu Pyo “Effect of Surface Roughness on Three-dimensional Integration on Back-illuminated Image Senor”, as a part of the 221st Meeting of The Electrochemical Society in Seattle, USA from May 6-10, 2012.
  53. Sung Gyu Pyo, Lee Seul Oh, Jae Bin Kim, Byoeng Gab Ji, Areum Kim, Eunmi Choi, Hyunjun Park “Effect of Pre-cleaning Treatment and Contact Wetting Angle in the Interface between P-doped Si surfaces and Selective Solar Cell Electrode”, as a part of the 2nd Electronic Materials and Nanotechnology for Green Environment (ENGE) in Jeju, Korea from Sep16-19, 2012.
  54. Sung Gyu Pyo, Eunmi Choi, Jae Bin Kim, Sun Jae Lee, Chang Hyun Kim, Soo Won Kim “Measurement of Ahesion and Bonding Strength Studies in 3D Interconnect Structures using Atomic Force Microscopy”, as a part of the 2nd Electronic Materials and Nanotechnology for Green Environment (ENGE) in Jeju, Korea from Sep16-19, 2012.
  55. Sung Gyu Pyo, Eunmi Choi, Hyunjin Park, Lee Seul Oh, Areum Kim “Interface Characterization and Evaluation of Reactive Preclean Process for the Removal of Cu oxide in Cu Nano Interconnect Process”, as a part of the 2nd Electronic Materials and Nanotechnology for Green Environment (ENGE) in Jeju, Korea from Sep16-19, 2012.
  56. Geunseon Ahn, Sung Gyu Pyo and Donghyun Lee “Enhancement of ostegenic differenciation of MC3T3-E1 cells in the presence of calcium phosphate cement–silica hybrid materials”, as a part of the 15th International Biotechnology Symposium and Exhibition(IBS 2012) in Daegu, Korea from Sep16-21, 2012.
  57. Nam Hee Kwon, S.M. Hong, Yong-Won cha, Sun Jae Lee, Han Gyul Lee, Areum Kim, Soo Won Kim, Chang Hyun Kim, and Sung Gyu Pyo, Effect of Planarity on the 3D Integration in 3-D Integrated CMOS Image Sensor, IEEE International 3D system Integration conference, 2012, Osaka, Japan
  58. Do Kyun Kwon, Soo Won Kim, Chang Hyun Kim, and Sung Gyu Pyo “High Efficiency and Low Cost Solar Cell Electrode Using Selective Electrode Formation Process”, as a part of the 220th Meeting of The Electrochemical Society in Boston, USA from Oct 9-14, 2011.
  59. Sung Gyu Pyo, Soo Won Kim, Chang Hyun Kim, H. Park, D.H. Lee, D.J. Kim, S. Kim “Development of Direct-Cu Pillar Processes in Cu-lowk interconnections”, as a part of the European Congress and Exhibition on Advanced Materials and Processes (EUROMAT) in Montpellier, France from Sep 12-15, 2011.
  60. Hansoo Park, Sung Gyu Pyo, Eun-Hee Choi and Soo-Hong Lee “Effect of Co-Culture Conditions on Differentiation of Adipose-Derived Stromal Cells into Nucleus Pulposus Cells”, as a part of the 4th International Conference on Tissue Engineering in Chania, Greece from May 31 – June 5, 2011.
  61. Do Kyun Kwon, Sun Jae Lee, Han Gyul Lee, Areum Kim, Soo Won Kim, Chang Hyun Kim, and Sung Gyu Pyo “Current Status of 3-D Integration Technologies: Bonding Technology and Wet Thin Film Process”, as a part of the 2011 Symposium of KIChe Materials Division in Jeju, Korea from Aug 24-26, 2011.
  62. Sung Gyu Pyo, Do Kyun Kwon, Dong Joon Kim and Sibum Kim “Development of 3-D Integrated CMOS Image Sensor”, as a part of 9th Korea-Japan Symposium on Materials & Interfaces in Yeosu, Korea from Oct. 31-Nov. 3, 2010.
  63. Sung Gyu Pyo (invited talk): Fabrication of backside-illuminated CMOS Image Sensor using 3-D Interconnect technologies, Korea Chemical Society, 2010 Oct.20~22 Daejeon
  64. Tom Joy, Sunggyu Pyo, Sunghyung Park, Changhoon Choi, Chintamani Palsule, Hyungjun Han, Chen Feng, Sangjoo Lee, Jeff McKee, Parker Altice, Chris Hong, Christian Boemler, Jerry Hynecek, Michael Louie, Juil Lee, Daebyung Kim, Homayoon Haddad and Bedabrata Pain, Development of a Production-Ready, Back-Illuminated CMOS Image Sensor with Small Pixels, IEDM, (2007) 37.2
  65. Sung Gyu Pyo, W.S. Min and Sibum Kim: Effect of Plasma pretreatment in Chemical Enhanced CVD Cu Process, The 13th Korean Conference of Semiconductors(KCS), 2006, Cheju
  66. Sung Gyu Pyo, Dok Won Lee, Min Hyung Lee, Chang Jin Ko and Sibum Kim: Correlationship of Plating Chemistry, Process and Hardware on the defectivity of Cu Plating Process in Cu Dual Damascene Interconnect, The 13th Korean Conference of Semiconductors(KCS), 2006, Cheju
  67. Dong Joon Kim, Sung Gyu Pyo, W.S. Min and S.B. Kim: Properties of Reactive Preclean and Cu Barrier Process Integration in Cu-low k Interconnection, The 13th Korean Conference of Semiconductors (KCS), 2006, Cheju
  68. Woo Sig Min, Dong Joon Kim, Sung Gyu Pyo, Sibum Kim, Jeong Gun Lee: Origin and improvement for thermally-induced via instability in Cu/OSG interconnect, The 12th Korean Conference on Semiconductors (KCS) 2005
  69. Min-Hyung Lee, Sung Gyu Pyo, Jong-Yeul Jeong and Si-Bum Kim: Optimization of Diffusion Barrier/Copper Interface for Damascene Nano-interconnects, The 12th Korean Conference on Semiconductors (KCS) 2005
  70. Woo Sig Min, Dong Joon Kim, Sung Gyu Pyo, Sibum Kim, Jeong Gun Lee: Origin and Improvement for Thermally-Induced Via Instability in Cu/OSG Interconnect, The 12th Korean Conference on Semiconductors (KCS) 2005
  71. Insoo Shin, Jungju Lee, Jinhan Lee, Ki-Ju Yee, and Kimin Hong, M. H. Lee, Sung Gyu Pyo, and Sibum Kim: Performance of new organic additives for 65 nm technology nodes copper interconnects, The 12th Korean Conference on Semiconductors (KCS) 2005
  72. Kimin Hong, Insoo Shin,Sibum Kim, Sung Gyu Pyo and M.H. Lee: Properties of organic additives and electroplated Cu film in 120nm Cu Lines, Conference of the Korean Institute of Physics, 2004, Cheju
  73. Woo Sig Min, Dong Joon Kim, Kyoung Ho Kim, Sung Gyu Pyo, Chan-Soo Shin, Hee Jeen Kim, Jong Sun Maeng, Sung Bo Whang, Sibum Kim, Jeong Gun Lee: A novel method for reliability evaluation in bottomless barrier scheme, Advanced Metallization Conference (AMC) 2004
  74. Sung Gyu Pyo, Woo Sig Min, Dok Won Lee, Sibum Kim and Jeong-Gun Lee: Effect of Novel Plasma Treatment on Superfilling Behavior in Chemically Enhanced CVD (CECVD) Cu Process, Conf. of Electrochemical Society(ECS), 2003 April "Thin Film Materials, Processes, and Reliability: Plasma Processing for the 100 nm Node and Copper Interconnects with Low-k Inter Level Dielectric Films", as a part of the 203rd Meeting of The Electrochemical Society in Paris, France from April 27-May 2, 2003
  75. D. Josell, Sibum Kim, D. Wheeler, T.P. Moffat and Sung Gyu Pyo: Quantifying Superconformal Filling of Submicrometer Features Through Surfactant Catalyzed Chemical Vapor Deposition, Conf. of Euro-CVD and ECS, 2003 April. Pp.98-103 , "CVD XVI and EUROCVD 14", as a part of the 203rd Meeting of The Electrochemical Society in Paris, France from April 27-May 2, 2003
  76. Sung Gyu Pyo, D.W. Lee, C.J. Ko, Sibum Kim and J.G. Lee: Effect of Acidity on Reduction of Defects in Electroplated Cu Film, Electrochemical Processing in ULSI Fabrication and Electrodeposition of and on Semiconductors VI", as a part of the 203rd Meeting of The Electrochemical Society in Paris, France from April 27-May 2, 2003
  77. S.K. Park, K. Pfeifer, M.Shibagaki, A. Sekeiguchi, T. Koide, T. Kuninobu, S. Aikyama, W.S. Min, and Sung Gyu Pyo: Integration of CVD Cu Seed with CVD Cu Barrier for Dual Damascene Cu Metallization, AMC(Advanced Metallization Conference) 2002, p433
  78. Woo Sig Min, Sung Gyu Pyo, Heon Do Kim, Sibum Kim, Tae Kwon Lee, Sang Kyun Park, Heung Lak Park, Hyun Chul Sohn: Improvement of TaNx Barrier Effectiveness without Cu (111) Texture Degradation, AMC(Advanced Metallization Conference) 2001, Montreal, p. 619
  79. Sung Gyu Pyo, Woo Sig Min, Heon Do Kim, Sibum Kim, Tae Kon Lee, Sang Kyun Park and Hyun Chul Sohn: Superfilling Characteristic and Evaluation of Chemically Enhanced CVD(CECVD) Cu Process, AMC(Advanced Metallization Conference) 2001, Montreal, p. 209
  80. Woo Sig Min, Sung Gyu Pyo, Heon Do Kim, Sibum Kim, Tae Kwon Lee, Sang Kyun Park, and Hyun Chul Sohn: Improvement of TaNx barrier effectivenss wihout Cu(111) texture degradation, Advanced Metallization Conference (AMC) 2001, Montreal, pp.619-626
  81. Woo Sig Min, Sung Gyu Pyo, Heon Do Kim, Sibum Kim, Tae Kwon Lee, and Heung Lak Park: The novel evaluation for extremely thin TaNx films as a copper barrier, Advanced Metallization Conference (AMC) 2000, San Diego, pp. 329-335
  82. N. J. Kim, S. Ahn, W. J. Park, S. G. Pyo, R. Schmees, H. J. Koh, S. J. Park, Y. S. Jin, and D. C. Chae: "Microstructure Control in Aluminum Alloy", 2th ISAPM, RIST Pohang, 1996. 11. 28
  83. S.G. Pyo and N. J. Kim: "Development of Microstructure in Mechanically Alloyed NiAl", in High-Temperature Ordered Intermetallic Alloys - VI, eds., J. Horton, L Baker, S. Hanada, R.D. Noebe and D.S. Schwartz, MRS, 364 (1995), pp. 585-590.
  84. S. G. Pyo and N. J. Kim: "Deformation and Fracture Behavior of PST Crystals of TiAI - TEM In-Situ Observation", in Gamma Titanium Aluminides, eds., Y.W. Kim, R. Wagner and M. Yamagnchi, TMS, Warrendale (1995), pp. 315-322.
  85. S. G. Pyo and N. J. Kim: "Compositional Effect on the Structure and Properties of (α2 +γ) Two-Phase TiAl Alloys", in Gamma Titanium Aluminides, eds., Y.W. Kim, R. Wagner and M. Yamaguchi, TMS, Warrendale (1995), pp. 779-786
  86. W.J. Park, H.J. Ko, Sung Gyu Pyo and Nack J. Kim : Development of New Material Using Convergent Beam Electron Diffraction(CBED) Techniques, Sym. Electron Microscope (1994), pp 3-20


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